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a | Precaution
For Use | |
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a | Precaution
For Use | |
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| Cleaning | 3.Lead forming should be performed prior to soldering. | ||||||||||||||||||||||||||||||||||||||||
| 1.Special care shall be taken when applying the chemicals listed below for cleaning because certain chemicals may damage the surface of lens or case and cause discoloration. | 4.Avoid applying any stress to resin in order to prevent the epoxy fracture and break on bonding wire. | ||||||||||||||||||||||||||||||||||||||||
| 5.Avoid Forming the lead Frame at the same point twice or more. | |||||||||||||||||||||||||||||||||||||||||
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| Soldering | |||||||||||||||||||||||||||||||||||||||||
| 1.Be sure not mount LEDs in conditions where excessive stress is applied to lead frames. | |||||||||||||||||||||||||||||||||||||||||
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| 2.Dipping time: 2 minutes max. at normal temperature. | |||||||||||||||||||||||||||||||||||||||||
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2.The mounting direction of the flat package type LED should be such that the direction of the LED electrodes is perpendicular to the direction of the board curve. |
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| Forming | 3.Ever-Led will not guarantee LEDs mounted directly on the board because the resin bodies may be damaged by the applied force from board - warping, lead-cutting or clinching when being soldered. (It is strongly recommended that this should be carried out after very careful preparation.) | ||||||||||||||||||||||||||||||||||||||||
| . | 1.The lead frame should be bent at a point 2 mm away from the body resin. | ||||||||||||||||||||||||||||||||||||||||
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| 4.Care should be taken to avoid any shock or vibration to the LED resin body after it has been soldered until the temperature of the LED has returned to normal. | |||||||||||||||||||||||||||||||||||||||||
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2.Bending should be performed with the base firmly fixed by means of a jig or radio pliers. | ||||||||||||||||||||||||||||||||||||||||
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5.Conditions |
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